By Mewati Sitaram
RRP Electronics has officially launched Maharashtra’s first OSAT (Outsourced Semiconductor Assembly and Test) and ATMP (Assembly, Testing, Marking, and Packaging) semiconductor manufacturing facility in Navi Mumbai, a pivotal moment for India’s semiconductor ambitions.
The inauguration was graced by Shri Eknath Shinde, Honorable Chief Minister of Maharashtra; Shri Devendra Fadnavis, Deputy Chief Minister; and Shri Ajit Pawar, Deputy Chief Minister of Finance. Notable attendees included Shri Uday Samant, Minister of Industries; Dr. Harshdeep Kamble, Principal Secretary of Industries, Government of Maharashtra; Bharat Ratna awardee and cricket legend Sachin Tendulkar; and Dr. Anil Kakodkar, Padma Vibhushan awardee and former Chairman of the Department of Atomic Energy.
With a robust technological partnership with HMT Microelectronic AG and its leading associates, this facility is poised to transform the semiconductor landscape. It will specialize in advanced packaging technologies, including QFN, BGA, SoC, and mixed ASICs.
In its initial phase, the facility is set to produce 10,000 wafers per month. Future plans include establishing a dedicated design house and expanding into LiDAR technology development to meet the increasing demand for automotive power chips, along with producing TFT and WATN components for automotive applications.
An MoU was signed between HMT Microelectronic AG and Renowa Vision Inc. This partnership with HMT focuses on projects related to QFN, BGA, and ASICs, with a planned expansion into LiDAR technology. The MoU with Renowa signifies a major advancement for RRP, enabling the acquisition of technology for OSAT and FAB for NAND memory chips—non-volatile storage solutions that retain data without power.
These agreements position RRP to generate assured revenue exceeding $50 million in the OSAT sector. This landmark project is a significant milestone for Maharashtra, further establishing the state as a vital player in India’s semiconductor mission.